Overview of eight-layer laminated board FPC

The eight-layer laminated board FPC (Flexible Printed Circuit) is a circuit board with high-density interconnection. It combines the flexibility of flexible substrates and the high-density wiring capability of multi-layer circuit boards. This type of FPC is usually composed of multiple layers of flexible substrates and circuit layers, with an insulating layer sandwiched in the middle, and the outermost layer is covered with a protective layer or a copper-clad layer.

Advantages and disadvantages of eight-layer laminated board FPC

Advantages:

1. High transmission performance: Since the eight-layer laminated board FPC can transmit more signals within an extremely small area on the board, it can improve the performance of the entire circuit.

2. High circuit line density: Circuit lines can be stacked between different layers, greatly increasing the complexity and functionality of the circuit while reducing the circuit size.

3. High reliability: The structure is more complex, and the circuit lines are more evenly and balancedly distributed inside the board. This can reduce the pressure on the circuit lines during system operation and improve the reliability and stability of the circuit.

4. High space utilization: The internal structure of the board is extremely compact, which can optimize the circuit design and stack different circuit components together. As a result, the space utilization is improved, and the volume of the entire circuit is reduced.

Disadvantages:

1. High manufacturing cost: Since it is necessary to stack multiple layers of circuits, delicate printing and assembly technologies are required during the production process. The production is difficult, and the production cost is also very high.

2. Complex termination method: The termination method is more complex than that of single-layer boards. Operations such as folding and interlayer connection are required, which increases the difficulty of the manufacturing process.

Application fields of eight-layer laminated board FPC

The application fields of eight-layer laminated board FPC are very extensive, mainly including the following aspects:

1. Automotive Electronics: Widely used in the internal electronic systems of automobiles, such as air conditioners, navigation systems, in – vehicle audio systems, etc.

2. Communication devices: They are increasingly used in communication devices, such as mobile phones, tablets, etc.

3. Industrial Control: It can provide high-performance industrial control systems, such as manufacturing automation and robotics.

4. Medical Devices: It is widely used in medical devices, such as medical instruments and some life monitoring devices.

Manufacturing process of eight – layer laminated board FPC

The manufacturing process of the eight-layer laminated board FPC is relatively complex, and it requires both FPC production equipment and PCB production equipment. In the production process, the following points need to be noted:

1. Numerous production processes: The production of eight – layer laminated board FPC involves numerous processes, with high production difficulty and a relatively low yield rate. It also requires a large amount of materials and manpower.

2. Full inspection stage: Since its value is relatively high, full inspection is generally carried out before shipment to avoid relevant losses of interests for both the supplier and the demander.

Conclusion

The eight-layer laminated board FPC is a high-performance circuit board that combines the flexibility of flexible substrates with the high-density wiring capabilities of multi-layer circuit boards. Although its manufacturing cost is relatively high, it has broad application prospects in fields such as automotive electronics, communication devices, industrial control, and medical equipment.