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The differences between FPC gold-immersion boards and gold-plated boards are mainly reflected in the following aspects:
Immersion gold board: Through a chemical reaction, specifically the deposition of a gold layer by chemical nickel – gold plating, a shiny gold coating is formed, just like a magician conjuring up a gold layer.
Gilded plate: Using the power of electrolysis and electric current, it coats itself with a gold plating through electroplating, just like a small electricity expert achieving gold plating with the help of electric current.
Immersion gold board: It presents a golden color, and its luster is more dazzling than that of the gold-plated board.
Gilded plate: The color is slightly whitish, similar to the color when a bit of nickel is mixed in.
Immersion gold board: It is easy to weld, and there will be no poor welding. It can be applied to various welding processes, such as wave soldering, reflow soldering, etc. Moreover, its crystal structure is dense, making it easier to weld.
Gold-plated board: It has relatively poor weldability, which is a major drawback of it.
Immersion gold board: There is gold only on the pads, and the solder mask on the circuit is tightly bonded to the copper layer, so there will be no problems during engineering compensation. Moreover, even when the wiring is fine (such as the minimum line spacing and line width of 2 mils), there will be no short – circuiting caused by gold wires.
Gold-plated board: In the case of increasingly fine wiring, the problem of short – circuits of gold wires is likely to occur, which is quite a headache.
Immersion Gold Board: It has a dense crystal structure, is not prone to oxidation, has first – class flatness, and good contact stability, which can maintain long – term reliability. At the same time, its stress is easier to control. For products with bonding, it is more conducive to bonding processing. However, the immersion gold board is not wear – resistant when used for gold fingers.
Gold-plated board: It can effectively resist oxidation, maintain the stable performance of the circuit board during long-term use, and also maintain long-term contact stability and reliability.
Immersion gold board: Usually has a relatively low cost; its service life is as good as that of the gold-plated board.
Gold-plated board: During the trial production stage, its cost is almost the same as that of the lead-tin alloy board. Moreover, the shelf life of the gold-plated board is many times longer than that of the lead-tin alloy board, and it is less affected by the changes in the external environmental temperature and humidity (compared with other surface treatments). Generally, it can be stored for about one year.
